Description

Overview

The USB 3.0 MUDP Chip is a miniature USB flash memory chipset designed for high-speed data transfer in a shell-free format. Built on the MUDP (Mini USB Disk in Package) architecture, it combines a USB 3.0 interface with a space-saving structure ideal for custom flash drive creation, embedded devices, and industrial applications. This plug-and-play solution supports fast, stable performance and is encapsulation-ready for waterproofing or rugged builds.


Key Features

USB 3.0 SuperSpeed Interface

Enjoy rapid data transfers with read speeds of up to 100 MB/s and write speeds of up to 60 MB/s—ideal for transferring large files, firmware, or video.

🧩 MUDP Bare Chipset Format

No casing means it’s optimized for custom encapsulation and compact installations. Integrates flash memory and controller into a single chip for simplicity.

💧 Waterproof Capability (After Encapsulation)

Once molded in plastic, silicone, or epoxy, this chip becomes waterproof, making it suitable for rugged or wearable USB products.

🏭 Optimized for Manufacturers and Developers

Perfect for bulk orders, OEM integration, and small electronics requiring embedded memory or compact removable storage.


Specifications

Feature Details
Product Type USB Flash Memory Chipset (MUDP Chip)
Interface USB 3.0 (backward compatible with USB 2.0)
Form Factor Bare MUDP chip, no shell
Capacities 8GB, 16GB, 32GB, 64GB, 128GB (varies by batch)
Read Speed Up to 100 MB/s
Write Speed Up to 60 MB/s
Waterproof Yes, when molded or encapsulated
Compatibility Windows, macOS, Linux, Android
Use Cases DIY USB drives, embedded electronics, rugged devices
Operating Temperature 0°C to 70°C
Storage Temperature -40°C to 85°C

Applications

  • DIY custom USB flash drives

     Mini USB Flash Memory
  • Compact embedded memory modules

  • Waterproof USB tools and accessories

  • Promotional tech gifts and novelty USBs

  • Electronics with removable internal storage


Advantages

  • ✅ USB 3.0 speed in a minimal design

  • ✅ Compact and casing-free for embedded use

  • ✅ Ready for waterproof molding

  • ✅ Cost-effective for bulk manufacturing

  • ✅ Easy integration for developers and OEMs

 

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